Nano diamond wheels for thin and ultra-thin IC grinding applications

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Actual Step 1: Upgrade your amor. Even though you will be leveling thei it quicker via grinding, grinding with your level gear in IC will help out a lot.

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Resin diamond grinding wheels are applied to the back thinning grinding (back grinding) of IC silicon wafers. The wheels should have very high performance

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Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated ...

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There are several methods that are presently being used for thinning wafers, the most popular being the well-established mechanical backgrinding and polishing technique.

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Standard Packing list: 1× IC Grinding Machine 1× one Mould ( the Mould total 5 models, but in pack only 1 mould for 4,4s,5,5c,5s, others for optional as follows ...

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